Robotic Haptic Sensing and Interaction in Medicine

Wednesday 6th February 2019, 6:30 pm.

Speaker: Dr Hongbin Liu, King’s College London

Venue: Room 4.31, University of Edinburgh Informatics Forum, 10 Crichton Street, Edinburgh.

This event is free of charge and open to all, though please register via Eventbrite: https://bcsedin060219.eventbrite.co.uk/

Refreshments and networking from 6:00 pm.

Synopsis

Haptic capability, both sensing and interaction, is essential for a robot working in unstructured environments, yet robotic haptic technology today is still very primitive compared to even the simplest biological creatures. Haptic interaction is a cornerstone of many medical interventions/practices. Our lab designs robots with advanced haptic perception and interaction capabilities to address unmet needs in medicine, enabling safer and more effective diagnosis and treatment. We commit our work to benefit both patients and the medical profession while advancing the frontier of haptic robotics research.
In this talk, I will share some applications of our research include haptic sensing for medical instruments, force sensing and control for robotic endoscopes for medical interventions, as well as robotic ultrasound guidance.

About the speaker

 

Hongbin Liu is a Senior Lecturer (Associate Professor) in the Department of Informatics, King’s College London (KCL) where he is directing the Haptic Mechatronics and Medical Robotics (HaMMeR) Laboratory. Dr. Liu obtained his BEng in 2005 from Northwestern Polytechnical University, China, MSc and PhD in 2006 and 2010 respectively, both from the Division of Engineering, KCL. He is a member of the IEEE, and a Technical Committee Member of IEEE EMBS BioRobotics. He has published over 100 peer-reviewed publications at top international robotic journals and conferences and is inventor for 4 patents. His research has been funded by EPSRC, Innovate UK, NHS Trust and EU Commissions. His current research focuses on developing soft robotic systems for assistive medical interventions, with strong collaborations from IBM and Ericsson.

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